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Low-Molecular-Weight Polyamide Resin for Epoxy Coatings & Flooring

Low-Molecular-Weight Polyamide Resin for Epoxy Coatings & Flooring

ブランド名: WeiLi Resin®
モデル番号: SE 5703B
Moq: 20FT コンテナ
価格: 交渉可能
支払条件: T/T
供給能力: 15T/month
詳細情報
起源の場所:
中国
証明:
ISO9001
外観:
明確、粘性液体
固形物:
88-92
粘度 (25°C,NDJ回転粘度計):
15000-30000cp
カラー(Fe-Co):
≦8#
仕組み:
195-205mgKOH/g
パッケージの詳細:
200kg/バレル
ハイライト:

low-molecular-weight polyamide resin

,

polyamide resin for epoxy coatings

,

polyamide resin for flooring

製品説明
Low-Molecular-Weight Polyamide Resin for Epoxy Coatings & Flooring SE-5703B is a high-viscosity, low-molecular-weight polyamide resin diluted with xylene. It is used as a curing agent for epoxy resins and is widely applied in the preparation of room-temperature-curing solvent-based epoxy resin coatings, heavy-duty anti-corrosion coatings, floor paints (epoxy flooring), and adhesives. It features relatively low viscosity for easy handling. When combined with epoxy resin, the